PCB Assembly

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Automated Assembly

Mixed Technology PCA

Quality PCA Manufacturing

The printed circuit board (PCB) is at the very heart of your product. So when it comes to printed circuit assembly (PCA), you want only the highest standards of quality and precision. BTW maintains these high standards through an unwavering attention to detail. We have the most thorough manufacturing and testing processes in place to ensure that every board is nothing short of perfect. And we continually seek new ways to improve those processes. While the PCB is at the heart of your product, printed circuit assembly is at the heart of our service. Together we will realize the results you are looking for.

Our solutions include surface mount (SMT), through-hole (PTH) and mixed technology assemblies. Our SMT lines consist of fully automatic, vision screen printers, multifunctional high-speed Juki placement machines, automated optical inspection (AOI) and seven zone convection reflow ovens. These Juki lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki technicians. You just won't experience down time!

Programmable robotic selective solder, wave solder machines and proven expertise developing custom tooling result in a complete suite of capabilities delivering all of your printed circuit assembly requirements. With BTW our matrix of high tech equipment, advanced processes and skilled personnel provide the high quality, low costs and consistent on-time delivery you wish to enjoy.

General Capabilities

Surface Mount
Mixed Technology
Through Hole
Lead and Lead Free
Clean and No-Clean
Single Sided Population
Double Sided Population

Circuit Board Construction

Rigid
Flexible
Combined Construction (Rigid and Flex)
Single and Multilayer

Board Thickness

Min
0.4mm
0.015"

Max
4mm
0.157"

PCB Panel Size

Min
50.8mm x 50.8mm
2" x 2"

Max
410mm x 360mm
16.14" x 14.17"

Component Size

0201 and Larger
01005 Capable

Lead Pitch

0.3mm
0.011"

Max
3mm
0.118"

Processes

Screen Printing Lead or Lead Free EdgeLoc Board Clamping Auto Pin Placement Closed-loop Print Head Squeegee Compliance Routine Quick Change Stencil Wiper Solvent Delivery Method 2D Inspection Capable	Pick and Place SMT 0201 and larger 11 Mil Pitch and up BGA and Micro BGA
Through-hole Component Lead Forming Axial Component Sequencing Manual/Mechanical Assembly	Soldering Lead or Lead Free Wave Reflow Selective / Robotic Hand Soldering PTH & Mixed Technology
Depaneling Nibbler Shear V-Score Router	Cleaning Aqueous Cleaning Closed Loop De-Ionized Wash Chemical Clean
Conformal Coating Dip, Manual, Aerosol, Non-Aerosol Acrylic, Silicon, Urethane	Inspection 2D Automated Solder Paste SMT Placement AOI – Automated Optical Ispection Real Time X-Ray Imaging Ersa Scope Flip Chip & BGA Inspection Digital & Optical Zoom Imaging Ionic Contamination Testing
Test ICT Functional Flying Probe	ESS – Environmental Stress Screening 24" x 24" x 24" -70° to +170°

Production Volume

Min: 1 unit

Max: Hundreds of Thousands of units

Prototypes
New Product Introduction (NPI)
Production
Post Production
High Mix Low Volume
High Volume Low Mix