PCB Assembly

BTW specializes in Surface Mount Technology (SMT), Plated Thru-Hole (PTH), and Mixed Technology assemblies. Our SMT lines consist of fully automatic vision screen printers, multi-functional high-speed Juki placement machines, Automated Optical Inspection (AOI) and thirteen zone convection reflow ovens. Our Juki SMT lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki field service Engineers. Our manufacturing team has over 25 years of Thru-Hole and Mixed Technology placement experience. BTW’s suite of advanced technologies in programmable robotic selective solder and wave solder paired with our experienced hand solder technicians and our tooling and test development expertise can deliver all of your Printed Circuit Board Assembly (PCA) needs in one convenient location.

Circuit Board Construction

  • Rigid

  • Flexible

  • Combined Construction (Rigid & Flex)

  • Single & Multi-layer

  • Alumiclad

  • Board Thickness: 0.015 – 0.157 inches (0.4 – 4mm)

  • "Standard" PCB Panel Size: 2.0 x 2.0 inches – 31.50 x 16.14 inches (50.8 x 50.8 – 800 x 410mm)
    *BTW is capable of running larger than standard dimensions with proper tooling development

  • Component Size: 01005 and Larger

  • Lead Pitch: 0.011 – 0.118 inches (0.3 – 3mm)

Process Control - Aegis Manufacturing Software

  • Barcoded Work In-Process (WIP) tracking

  • Product Traceability

  • On-line Defect Collection

  • Bill of Material Management

  • Machine Programming

  • Quality Reporting

  • CAD Data Importation

Screen Printing

  • Lead, Lead Free, Water Soluble and No-clean processing

  • EdgeLoc Board Clamping

  • Auto Pin Placement

  • Closed-loop Print Head

  • Squeegee Compliance Routine

  • Quick Change Stencil Wiper

  • Solvent Delivery Method

  • 2D Inspection Capable

Pick and Place

  • SMT - Surface Mouth Technology

  • 01005 and larger

  • 11+ Mil Pitch

  • BGA and Micro BGA

Through-Hole

  • Component Lead Forming

  • Manual/Mechanical Assembly

Soldering

  • Leaded, Lead Free, Water Soluble and No-clean Solder

  • Wave

  • Reflow

  • Selective / Robotic

  • Hand Soldering

  • PTH & Mixed Technology

Depaneling

  • Nibbler

  • Shear

  • V-Score

  • Router

Cleaning

  • Aqueous Cleaning

  • Closed Loop De-Ionized Wash

  • Chemical Clean

Test

  • ICT – In Circuit Testing

  • Functional Testing

Inspection

  • 2D Automated Solder Paste

  • SMT Placement

  • AOI – Automated Optical Inspection

  • Real Time X-Ray Imaging

  • Ersa Scope Flip Chip & BGA Inspection

Production Capacity

  • MINIMUM: 1 unit

  • MAXIMUM: Hundreds of Thousands of units

  • High Mix Low Volume

  • High Volume Low Mix

  • Prototypes

  • New Product Introduction (NPI)

  • Production

  • Post Production